Two-dimensional Heat Transfer Along Rectangular Chimney

Yonas Tibebu Mekonnen, Olawale Samuel Fatoba, Tien Chien Jen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper dealt with the design and modeling of a rectangular chimney heat loss to the surrounding through one meter length chimney. The existing chimney and the problems associated with them were analyzed. The need for and importance of this work were also highlighted. The design consists of 4 sections: Finite Difference Formulation of This Problem for Steady Two-Dimensional Heat Transfer, Determine the Temperatures at The Nodal Points of a Cross Section, And Determine the Temperatures at the Nodal points of a Cross Section and finally simulation using ANSYS software. The analytical approaches used to find the rate of heat loss and how heat conducted on the chimney with the new design and analyze to identify the power output. Using the principles of finite difference method, this work was able to establish the rate of heat loss through a 1-m long section of the chimney.

Original languageEnglish
Title of host publication2022 IEEE 13th International Conference on Mechanical and Intelligent Manufacturing Technologies, ICMIMT 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages281-284
Number of pages4
ISBN (Electronic)9781665484008
DOIs
Publication statusPublished - 2022
Event13th IEEE International Conference on Mechanical and Intelligent Manufacturing Technologies, ICMIMT 2022 - Virtual, Online, South Africa
Duration: 25 May 202227 May 2022

Publication series

Name2022 IEEE 13th International Conference on Mechanical and Intelligent Manufacturing Technologies, ICMIMT 2022

Conference

Conference13th IEEE International Conference on Mechanical and Intelligent Manufacturing Technologies, ICMIMT 2022
Country/TerritorySouth Africa
CityVirtual, Online
Period25/05/2227/05/22

Keywords

  • chimney
  • heat loss
  • temperature
  • thermal flux
  • thermal gradient

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Artificial Intelligence
  • Computer Science Applications

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