@inbook{06857824a6ab4b67aea01cb1e2a1bb74,
title = "Traditional Approach: System-on-Chip",
abstract = "This chapter starts a series of three chapters focusing on specific packaging alternatives. Specifically, the aim of this chapter is to bring closer all the advantages, disadvantages and challenges of possibly the most widely used packaging approach—namely the approach to packaging of the complete system on one chip—SoC. Figure 6.1 is updated from Fig. 1.16 from Chap. 1 and shows how this packaging approach interacts with other packaging strategies, which will be discussed in subsequent chapters.",
author = "Mladen Bo{\v z}ani{\'c} and Saurabh Sinha",
note = "Publisher Copyright: {\textcopyright} 2019, Springer Nature Switzerland AG.",
year = "2019",
doi = "10.1007/978-3-030-14690-0_6",
language = "English",
series = "Smart Sensors, Measurement and Instrumentation",
publisher = "Springer International Publishing",
pages = "157--191",
booktitle = "Smart Sensors, Measurement and Instrumentation",
}