Traditional Approach: System-on-Chip

Mladen Božanić, Saurabh Sinha

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

1 Citation (Scopus)


This chapter starts a series of three chapters focusing on specific packaging alternatives. Specifically, the aim of this chapter is to bring closer all the advantages, disadvantages and challenges of possibly the most widely used packaging approach—namely the approach to packaging of the complete system on one chip—SoC. Figure 6.1 is updated from Fig. 1.16 from Chap. 1 and shows how this packaging approach interacts with other packaging strategies, which will be discussed in subsequent chapters.

Original languageEnglish
Title of host publicationSmart Sensors, Measurement and Instrumentation
PublisherSpringer International Publishing
Number of pages35
Publication statusPublished - 2019

Publication series

NameSmart Sensors, Measurement and Instrumentation
ISSN (Print)2194-8402
ISSN (Electronic)2194-8410

ASJC Scopus subject areas

  • Computer Science (miscellaneous)
  • Instrumentation
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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