@inproceedings{52773985b5e4438a867a60620b3634f5,
title = "Thermal aspects of grinding. The effect of flow boiling",
abstract = "A model of heat transfer in grinding was previously developed which predicts the temperature in the grinding zone. This model assumed an abrupt transistor between no boiling and film boiling over the entire grinding zone. An improved model is presented here, which accounts for the effect of flow boiling and its variation through the grinding zone. The dependence of the workpiece background temperature on the various grinding parameters is investigated. The workpiece background temperature distribution along the grinding zone, and comparisons with previous results are also presented.",
author = "Jen, {Tien Chien} and Lavine, {Adrienne S.}",
year = "1992",
language = "English",
isbn = "0791809226",
series = "American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD",
publisher = "Publ by ASME",
pages = "91--98",
booktitle = "Transport Phenomena in Materials Processing and Manufacturing",
note = "28th National Heat Transfer Conference and Exhibition ; Conference date: 09-08-1992 Through 12-08-1992",
}