Skip to main navigation Skip to search Skip to main content

Thermal analysis of the grinding process

  • R. J. Gu
  • , M. Shillor
  • , G. C. Barber
  • , T. Jen
  • Oakland University
  • Department of Mathematical Sciences
  • Oakland University
  • University of Wisconsin

Research output: Contribution to journal › Article › peer-review

42 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Thermal analysis of the grinding process'. Together they form a unique fingerprint.
Sort by

Keyphrases

Engineering

Material Science