Testing of MOSFETs Surfaces Using Image Acquisition

The image processing is frequently used in the systems for monitoring and controlling of the objects to support in an effective management of their resources and safety. The practical systems for monitoring the rectangular objects, like DG MOSFET, and cylindrical objects like CSDG MOSFET, which requires various vision sensors, recording images that have to be transmitted to and processed in the central processing unit [1]. One of the most challenging problems in such cases is the effective transmission and processing of huge amount of image data. To avoid overloading of transmission channels and central unit, various already existing algorithms are frequently performed at the sensors by an integrated low-level image processor. As a result, the rough image data generated by the sensor can be compressed or replaced by useful information extracted from the images. This approach significantly improves the overall efficiency and the cost of the system. A complete vision chip consisting of a photodetector array, which is effectively implemented on DG MOSFET and CSDG MOSFET, is formed on the rectangular and cylindrical substrate, respectively [2].