TY - CHAP
T1 - State-of-the-Art Approach
T2 - System-on-Package
AU - Božanić, Mladen
AU - Sinha, Saurabh
N1 - Publisher Copyright:
© 2019, Springer Nature Switzerland AG.
PY - 2019
Y1 - 2019
N2 - Up to this point in the book, two system packaging strategies have been discussed in much detail: SoC, where all system components have to appear on one IC die, and MCM, where all system components appear on two or more dice, but the packaging is shared by all of them. What both of these packaging strategies lack is provision for additional system components to be included in the package, external to all dice. This where the concept of SoP comes into play.
AB - Up to this point in the book, two system packaging strategies have been discussed in much detail: SoC, where all system components have to appear on one IC die, and MCM, where all system components appear on two or more dice, but the packaging is shared by all of them. What both of these packaging strategies lack is provision for additional system components to be included in the package, external to all dice. This where the concept of SoP comes into play.
UR - http://www.scopus.com/inward/record.url?scp=85064730746&partnerID=8YFLogxK
U2 - 10.1007/978-3-030-14690-0_8
DO - 10.1007/978-3-030-14690-0_8
M3 - Chapter
AN - SCOPUS:85064730746
T3 - Smart Sensors, Measurement and Instrumentation
SP - 229
EP - 271
BT - Smart Sensors, Measurement and Instrumentation
PB - Springer International Publishing
ER -