TY - JOUR
T1 - Review of atomic layer deposition process, application and modeling tools
AU - Justin Kunene, Thokozani
AU - Kwanda Tartibu, Lagouge
AU - Ukoba, Kingsley
AU - Jen, Tien Chien
N1 - Publisher Copyright:
© 2022
PY - 2022/1
Y1 - 2022/1
N2 - Atomic layer deposition is a highly sought-after technique with high conformal and quality film deposition. This study reviewed thin-film technology comprehensively and narrowed it to atomic layer deposition. Atomic layer deposition and associated terms and technology were discussed in detail. The study will be helpful to everyone interested in high precision and quality film deposition. The paper also discussed atomic layer deposition models and simulation tools with relevant studies examined. Molecular dynamics, Monte Carlo, and other models examined atomic layer deposition. Precision control of the sticking coefficients using Langmuir was also discussed. The paper will contribute to the body of knowledge for thin film, atomic layer deposition, modeling, and simulations with diverse real-life applications.
AB - Atomic layer deposition is a highly sought-after technique with high conformal and quality film deposition. This study reviewed thin-film technology comprehensively and narrowed it to atomic layer deposition. Atomic layer deposition and associated terms and technology were discussed in detail. The study will be helpful to everyone interested in high precision and quality film deposition. The paper also discussed atomic layer deposition models and simulation tools with relevant studies examined. Molecular dynamics, Monte Carlo, and other models examined atomic layer deposition. Precision control of the sticking coefficients using Langmuir was also discussed. The paper will contribute to the body of knowledge for thin film, atomic layer deposition, modeling, and simulations with diverse real-life applications.
KW - Atomic layer deposition
KW - Simulation
KW - Sticking coefficient
KW - Thin films
UR - http://www.scopus.com/inward/record.url?scp=85128638132&partnerID=8YFLogxK
U2 - 10.1016/j.matpr.2022.02.094
DO - 10.1016/j.matpr.2022.02.094
M3 - Article
AN - SCOPUS:85128638132
SN - 2214-7853
VL - 62
SP - S95-S109
JO - Materials Today: Proceedings
JF - Materials Today: Proceedings
ER -