TY - CHAP
T1 - Research Impact of System-Level Packaging for Millimeter-Wave Transceivers
AU - Božanić, Mladen
AU - Sinha, Saurabh
N1 - Publisher Copyright:
© 2019, Springer Nature Switzerland AG.
PY - 2019
Y1 - 2019
N2 - The world, as we know it today, at the end of the second decade of the twenty-first century, is a world in which everybody and everything is connected. Even ten years ago, although connectivity was ever present and social networks were experiencing a boom, portable connectivity was still in its adoption phase. The first cellular phones with large touch screens had just appeared on the market, tablets were yet to be marketed and a significant portion of internet users was still connecting to the internet using desktop computers.
AB - The world, as we know it today, at the end of the second decade of the twenty-first century, is a world in which everybody and everything is connected. Even ten years ago, although connectivity was ever present and social networks were experiencing a boom, portable connectivity was still in its adoption phase. The first cellular phones with large touch screens had just appeared on the market, tablets were yet to be marketed and a significant portion of internet users was still connecting to the internet using desktop computers.
UR - http://www.scopus.com/inward/record.url?scp=85064745139&partnerID=8YFLogxK
U2 - 10.1007/978-3-030-14690-0_1
DO - 10.1007/978-3-030-14690-0_1
M3 - Chapter
AN - SCOPUS:85064745139
T3 - Smart Sensors, Measurement and Instrumentation
SP - 1
EP - 29
BT - Smart Sensors, Measurement and Instrumentation
PB - Springer International Publishing
ER -