@inproceedings{52db1a8c9da64a59ae2491a282534f88,
title = "Reinforcement of Polymer Bio-Composite with Melon Shell Particles for Engineering Application",
abstract = "There have been global research efforts dedicated to developing cost-effective composite materials with high sustainability properties. A lot of materials have been tested in this drive, especially materials and combinations of materials thought to enhance engineering properties. An investigation into the development of bio-composites with improved properties using epoxy/melon shell particles reinforcement is presented. The study employs experimental research design techniques. In execution, the solution casting technology was the choice for producing the experimental samples. The matrix material used was Epoxy LY 556 resin while HY951 acted as the hardener. A matrix-hardener mixing ratio of 10:1 by weight was used. During the tests, the melon shell particles (MSP) maintained a 5 percent weight stepwise variation through 30\% weight in the epoxy matrix. The results shows that incremental addition of the MSP particles leads to significant increase in all the mechanical and electrical properties of the composite. Also, the result show a point of inflection in the tensile strength after the 20th weight percent MSP addition, while other quantities maintained a proportional increment with percentage weight MSP increase. The resulting composites can therefore be recommended for enhancing selected electro-mechanical properties in outdoor and indoor engineering materials consideration.",
keywords = "Composite, Electromechanical properties, Engineering applications, Epoxy, Melon shell particle",
author = "Aigbodion, \{V. S.\} and Ozor, \{P. A.\} and C. Mbohwa",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 4th IEEE International Conference on Nanoscience and Technology, ICNST 2021 ; Conference date: 26-06-2021 Through 28-06-2021",
year = "2021",
doi = "10.1109/ICNST52433.2021.9509327",
language = "English",
series = "2021 IEEE 4th International Conference on Nanoscience and Technology, ICNST 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "69--72",
booktitle = "2021 IEEE 4th International Conference on Nanoscience and Technology, ICNST 2021",
address = "United States",
}