Reconciling viability and cost-effective shape memory alloy options – A review of copper and iron based shape memory metallic systems

Kenneth Kanayo Alaneme, Eloho Anita Okotete

Research output: Contribution to journalReview articlepeer-review

126 Citations (Scopus)

Abstract

Shape memory alloys (SMAs) are group of alloys that display anthropomorphic characteristics. These alloys recover their pre-deformed morphology when heated above their transition temperatures after being deformed in their lower temperature phase (martensitic phase). This unique material behavior is explored in industrial and technological applications where capacity for strain recovery is a key design parameter. Copper and iron based SMAs are largely viewed as potential cost effective substitute to Ni–Ti SMAs judging from their promising shape memory properties, damping capacity and other functional properties. Despite their outstanding potentials, the susceptibility of copper based SMAS to phase stabilization, transition hysteresis, aging and brittleness creates doubt on the possibility of transiting from the realm of potential to functional long term use in engineering applications. On the other hand the low percentage shape recovery in the Fe based SMAs also creates a gap between the theory and potential use of these alloys. This paper takes a critical look at the science of shape memory phenomena as applicable to copper and iron based SMA systems. It also covers the limitations of these systems, the effect of processing parameters on these alloys, proposed solutions to limitations associated with this group of shape memory alloys and thoughts for future consideration.

Original languageEnglish
Pages (from-to)1582-1592
Number of pages11
JournalEngineering Science and Technology, an International Journal
Volume19
Issue number3
DOIs
Publication statusPublished - 1 Sept 2016
Externally publishedYes

Keywords

  • Copper alloys
  • Fe alloys
  • Ni–Ti
  • Phase stabilization
  • Shape memory alloys
  • Transition hysteresis

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Civil and Structural Engineering
  • Biomaterials
  • Mechanical Engineering
  • Hardware and Architecture
  • Fluid Flow and Transfer Processes
  • Computer Networks and Communications
  • Metals and Alloys

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