Re-melting and re-solidification of substrate during transient liquid phase diffusion bonding process for Al-Mg alloy

Tien Chien Jen; Yuning Jiao

Re-melting and re-solidification of substrate during transient liquid phase diffusion bonding process for Al-Mg alloy

University of Wisconsin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

A one-dimensional mathematical model is developed to predict the re-melting and resolidification procedure during the transient liquid phase (TLP) diffusion bonding process for Al-Mg alloy. The macroscopic solute diffusion in the liquid and the solid as well as for the solid transformation to the liquid due to the solute macrosegregation are considered in this study. The effects of holding temperatures and the holding time on re-melting layer and the mushy zone thickness of the TLP diffusion bonding process are investigated. It is shown numerically that the holding time and the holding temperature influence the solute distribution strongly, which in turn influence the mushy zone thickness significantly.

Original language	English
Title of host publication	Proceedings of the 2001 National Heat Transfer Conference Volume 1
Pages	475-481
Number of pages	7
Publication status	Published - 2001
Externally published	Yes
Event	2001 National Heat Transfer Conference (NHTC2001) - Ananheim, CA, United States Duration: 10 Jun 2001 → 12 Jun 2001

Publication series

Name	Proceedings of the National Heat Transfer Conference
Volume	1

Conference

Conference	2001 National Heat Transfer Conference (NHTC2001)
Country/Territory	United States
City	Ananheim, CA
Period	10/06/01 → 12/06/01

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)
Engineering (miscellaneous)

Cite this

@inproceedings{85a9e2bdf59b4ee4843182bb7bd775ce,

title = "Re-melting and re-solidification of substrate during transient liquid phase diffusion bonding process for Al-Mg alloy",

abstract = "A one-dimensional mathematical model is developed to predict the re-melting and resolidification procedure during the transient liquid phase (TLP) diffusion bonding process for Al-Mg alloy. The macroscopic solute diffusion in the liquid and the solid as well as for the solid transformation to the liquid due to the solute macrosegregation are considered in this study. The effects of holding temperatures and the holding time on re-melting layer and the mushy zone thickness of the TLP diffusion bonding process are investigated. It is shown numerically that the holding time and the holding temperature influence the solute distribution strongly, which in turn influence the mushy zone thickness significantly.",

author = "Jen, {Tien Chien} and Yuning Jiao",

year = "2001",

language = "English",

isbn = "0791835332",

series = "Proceedings of the National Heat Transfer Conference",

pages = "475--481",

booktitle = "Proceedings of the 2001 National Heat Transfer Conference Volume 1",

note = "2001 National Heat Transfer Conference (NHTC2001) ; Conference date: 10-06-2001 Through 12-06-2001",

}

Jen, TC & Jiao, Y 2001, Re-melting and re-solidification of substrate during transient liquid phase diffusion bonding process for Al-Mg alloy. in Proceedings of the 2001 National Heat Transfer Conference Volume 1. Proceedings of the National Heat Transfer Conference, vol. 1, pp. 475-481, 2001 National Heat Transfer Conference (NHTC2001), Ananheim, CA, United States, 10/06/01.

Re-melting and re-solidification of substrate during transient liquid phase diffusion bonding process for Al-Mg alloy. / Jen, Tien Chien; Jiao, Yuning.
Proceedings of the 2001 National Heat Transfer Conference Volume 1. 2001. p. 475-481 (Proceedings of the National Heat Transfer Conference; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Re-melting and re-solidification of substrate during transient liquid phase diffusion bonding process for Al-Mg alloy

AU - Jen, Tien Chien

AU - Jiao, Yuning

PY - 2001

Y1 - 2001

N2 - A one-dimensional mathematical model is developed to predict the re-melting and resolidification procedure during the transient liquid phase (TLP) diffusion bonding process for Al-Mg alloy. The macroscopic solute diffusion in the liquid and the solid as well as for the solid transformation to the liquid due to the solute macrosegregation are considered in this study. The effects of holding temperatures and the holding time on re-melting layer and the mushy zone thickness of the TLP diffusion bonding process are investigated. It is shown numerically that the holding time and the holding temperature influence the solute distribution strongly, which in turn influence the mushy zone thickness significantly.

AB - A one-dimensional mathematical model is developed to predict the re-melting and resolidification procedure during the transient liquid phase (TLP) diffusion bonding process for Al-Mg alloy. The macroscopic solute diffusion in the liquid and the solid as well as for the solid transformation to the liquid due to the solute macrosegregation are considered in this study. The effects of holding temperatures and the holding time on re-melting layer and the mushy zone thickness of the TLP diffusion bonding process are investigated. It is shown numerically that the holding time and the holding temperature influence the solute distribution strongly, which in turn influence the mushy zone thickness significantly.

UR - http://www.scopus.com/inward/record.url?scp=0346325760&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0346325760

SN - 0791835332

T3 - Proceedings of the National Heat Transfer Conference

SP - 475

EP - 481

BT - Proceedings of the 2001 National Heat Transfer Conference Volume 1

T2 - 2001 National Heat Transfer Conference (NHTC2001)

Y2 - 10 June 2001 through 12 June 2001

ER -

Re-melting and re-solidification of substrate during transient liquid phase diffusion bonding process for Al-Mg alloy

Abstract

Publication series

Conference

ASJC Scopus subject areas

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