@inproceedings{805a957a068948e4afd5efbb77ce467a,
title = "Qualitative exploration into the application of Systems Engineering within a South African science council",
abstract = "A description is provided on how good systems engineering processes and methods are used so that gaps can be determined by quantitative methods for informing training programs. The Systems Engineering Capability Model (SECM) is used to determine how good systems engineering methods and processes are performed implicitly and explicitly as well as indicating the gaps. This study focuses on the systems engineering methods currently being used within one of the engineering business unit at a research council. Gaps between the current practices in competency areas are identified for consideration of possible interventions. Qualitative method where empirical data was collected through interviews and transcribed, is processed with an appropriate qualitative tool. This research shows that the Integrative Competency Area (ICA) knows the processes and use them well. In the Technical Competency Areas (TCA) some people use it implicitly, while others do not know about it. There is a general request for making processes, templates more readily available for people to use inside the organization. This research shows the gaps that can be addressed through the designing of training programs within the organization. This research could be extended to study other areas within the science council as well as other organizations.",
keywords = "Capability model, Systems engineering, Systems engineering management",
author = "Malik, {Humna H.} and Louwrence Erasmus and Pretorius, {Jan Harm C.}",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 IEEE Technology and Engineering Management Society Conference, TEMSCON 2017 ; Conference date: 08-06-2017 Through 10-06-2017",
year = "2017",
month = jul,
day = "31",
doi = "10.1109/TEMSCON.2017.7998380",
language = "English",
series = "2017 IEEE Technology and Engineering Management Society Conference, TEMSCON 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "221--226",
booktitle = "2017 IEEE Technology and Engineering Management Society Conference, TEMSCON 2017",
address = "United States",
}