Precise control of precursor sticking coefficient on substrates with large aspect ratios in ALD

T. J. Kunene, L. Tartibu, T. C. Jen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, the Atomic Layer Deposition (ALD) process in the reactor scale was simulated using ANSYS® Fluent® 19.1 and ChemKin-PRO commercial packages in order to solve transport and chemistry equations. Trenched substrates with large aspect ratios (AR) of 33 ≤ AR ≤ 300, at a reactor scale of an ALD process, were considered a temperature of 473K and 573K. Trimethlyaluminum (TMA) and Ozone reactants were used to formulate a precise Sticking Coefficients (SC) for a satisfactory dose (precursor exposure level) in order to deposit conforming Al2O3 films. The estimated error in the empirical correlation of SCs was determined and compared to published experimental data. An empirical correlation based on simulated models was derived. This correlation can be exploited to determine precise precursor exposure levels for an ALD process irrespective of the type of reactor used.

Original languageEnglish
Title of host publicationAdvanced Materials
Subtitle of host publicationDesign, Processing, Characterization, and Applications
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791859490
DOIs
Publication statusPublished - 2019
EventASME 2019 International Mechanical Engineering Congress and Exposition, IMECE 2019 - Salt Lake City, United States
Duration: 11 Nov 201914 Nov 2019

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume12

Conference

ConferenceASME 2019 International Mechanical Engineering Congress and Exposition, IMECE 2019
Country/TerritoryUnited States
CitySalt Lake City
Period11/11/1914/11/19

Keywords

  • Aspect Ratios
  • Atomic Layer Deposition
  • Sticking Coefficient

ASJC Scopus subject areas

  • Mechanical Engineering

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