New sights in the improvement of fracture toughness and electrical conductivity of epoxy composites through chemical hybridization of carbon nanotubes with CaCO3 derived from waste eggshell

Esther Chinelo Omah, Chukwuemeka Jude Ohagwu, Vincent Chukwudi Chijindu, Mamilus Aginwa Ahaneku, Victor Sunday Aigbodion

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The ability of epoxy composites to provide both high toughness and outstanding electrical conductivity is critical in several technical applications such as boards, electronic devices, anti-static electricity, and electromagnetic shielding. However, it was difficult to obtain the high toughness and electrical conductivity of conducting polymer to suit this purpose. Hence, this work will investigate the fracture toughness and electrical conductivity of epoxy/carbon nanotube surfaces coated with CaCO3 derived from waste eggshell (CNTs/CaCO3-ESp) for high toughness and electrical conductivity. The CNTs/CaCO3-ESp was produced by growing CNTs on CaCO3-ESp through a chemical hybridization process. The CNTs were firmly attached to the CaCO3-ESp and enhanced the dispersion of CNTs in the epoxy matrix. The electrical conductivity and fracture toughness of the epoxy/1.5wt% CaCO3-ESp-CNTs were improved by 235,789% and 6.51%, respectively. The fracture surface shows homogenous dispersion of CaCO3-ESp-CNTs in the epoxy matrix. It was found that used eggshells can be used to change CNTs so that they can be used to make epoxy composites with better strength and electrical conductivity for the electronics industry.

Original languageEnglish
Pages (from-to)5079-5089
Number of pages11
JournalInternational Journal of Advanced Manufacturing Technology
Volume121
Issue number7-8
DOIs
Publication statusPublished - Aug 2022

Keywords

  • Carbon nanotubes
  • Eggshell
  • Electrical conductivity
  • Epoxy
  • Fracture toughness

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Mechanical Engineering
  • Computer Science Applications
  • Industrial and Manufacturing Engineering

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