TY - JOUR
T1 - New development of atomic layer deposition
T2 - processes, methods and applications
AU - Oviroh, Peter Ozaveshe
AU - Akbarzadeh, Rokhsareh
AU - Pan, Dongqing
AU - Coetzee, Rigardt Alfred Maarten
AU - Jen, Tien Chien
N1 - Publisher Copyright:
© 2019, © 2019 The Author(s). Published by National Institute for Materials Science in partnership with Taylor & Francis Group.
PY - 2019/12/31
Y1 - 2019/12/31
N2 - Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.
AB - Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.
KW - 10 Engineering and Structural materials
KW - 102 Porous / Nanoporous / Nanostructured materials
KW - 306 Thin film / Coatings
KW - 400 Modeling / Simulations
KW - Atomic layer deposition
KW - Computational fluid dynamics
KW - Molecular dynamics
KW - Thin film
UR - http://www.scopus.com/inward/record.url?scp=85068826045&partnerID=8YFLogxK
U2 - 10.1080/14686996.2019.1599694
DO - 10.1080/14686996.2019.1599694
M3 - Review article
AN - SCOPUS:85068826045
SN - 1468-6996
VL - 20
SP - 465
EP - 496
JO - Science and Technology of Advanced Materials
JF - Science and Technology of Advanced Materials
IS - 1
ER -