Nanofillers in Electronics Industry

The composite materials have attracted a lot of interest for their prospective benefits in industrial, automotive, and microelectronics applications due to their higher strength to weight ratio and inexpensive price. However, it is important to reinforce micro- and nanoparticles known as fillers in the matrix material in order to achieve the best performance from the composites. In general, filler is an additional substance used to fill a void or add bulk. Further, filler is a substance that is added to polymers to alter the properties of the final product, enhance processing behavior, or lower the cost of the compound. The discussion of filler nanocomposites in this book chapter in light of their huge potential for use in electronic applications. The compatibility and interface between the matrix and filler play a big part in how the properties of nanocomposites change. For a variety of micro- and nano-electronic devices, ceramic-reinforced nanocomposites are intriguing potential dielectric materials. The resulting nanocomposites have high dielectric breakdown strength due to the ceramic fillers’ synergistic interaction with the polymer matrix, which includes strong thermal conductivity, low thermal expansion, and a dielectric constant. Dielectric properties take into account filler alignment methods and how they affect composites has been discussed. Additionally, the impact of different surface-modified filler materials in polymer matrix and the advantages of filler alignment for electronics applications of the device are all covered in this book chapter.