Millimeter-Wave Substrates and System-Level Approach in Millimeter-Wave Research and Design

Mladen Božanić, Saurabh Sinha

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

With device scaling, the number and the density of components that can be placed on chip increase. With every new process generation, more and more active devices can be placed into a small area of the IC chip. The phenomenon that is now known as Moore’s law indicates that the circuit density roughly doubles every 18 or 24 months.

Original languageEnglish
Title of host publicationLecture Notes in Electrical Engineering
PublisherSpringer
Pages75-111
Number of pages37
DOIs
Publication statusPublished - 2020

Publication series

NameLecture Notes in Electrical Engineering
Volume658
ISSN (Print)1876-1100
ISSN (Electronic)1876-1119

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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