Mechanism controlling thermal conductivity and coefficient of copper metal matrix composites

David Esezobor, Samuel Fatoba

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The potential demands for reliable materials in electronic industries are ever increasing. The main pronounced failure that occurs during microelectronic circuits application involves thermal fatigue. This occurs due to the different thermal expansion coefficient of semi conductor chip and packaging material. Thus, the search for appropriate coefficient of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is inevitable in the design and selections of it sink material. An attempt as been made in this research work to produce copper matrix composites using silicon carbide (SiC) as reinforcement. This is aimed at getting a material with high thermal conductivity using non convectional liquid metallurgy. Copper silicon carbide composites were produced in 80%Cu - 20%SiC, 70%Cu - 30%SiC, 60% Cu - 40% SiC, 50% Cu - 50%SiC, 40%Cu - 60%SiC ratios with an average grain size of 212μm, 425μm and 710μm respectively via liquid metallurgy route. The result revealed that increasing volume fraction and increasing particle size of the particulate had significant effect on the thermo-physical properties. This phenomenon is explained using the evolving microstructures.

Original languageEnglish
Title of host publicationMaterials Science and Technology Conference and Exhibition 2009, MS and T'09
Pages1795-1805
Number of pages11
Publication statusPublished - 2009
Externally publishedYes
EventMaterials Science and Technology Conference and Exhibition 2009, MS and T'09 - Pittsburgh, PA, United States
Duration: 25 Oct 200929 Oct 2009

Publication series

NameMaterials Science and Technology Conference and Exhibition 2009, MS and T'09
Volume3

Conference

ConferenceMaterials Science and Technology Conference and Exhibition 2009, MS and T'09
Country/TerritoryUnited States
CityPittsburgh, PA
Period25/10/0929/10/09

Keywords

  • Copper silicon composite
  • Electronic
  • Thermo-physical property

ASJC Scopus subject areas

  • General Materials Science

Fingerprint

Dive into the research topics of 'Mechanism controlling thermal conductivity and coefficient of copper metal matrix composites'. Together they form a unique fingerprint.

Cite this