Epoxy resin in organic WORM memories: From capsuling to the active layer

The production of organic memory devices comprises the preparation of the substrate, deposition of the active layer and the electrodes, and the final capsuling. Owing to the low cost and robustness of the epoxy resin - a typical encapsulant - compared to other polymers employed on the active layer, we propose the development epoxy based memories. We successfully produced epoxy resin/carbon spheres nanocomposite-based organic WORM memories with an I_ON/I_OFF ratio of the order of 10⁵, low recording voltages of 2.5 V, and thermally and electrically stable during a test period of 30 days. For the concentration 0.4 wt% and the film thickness 1.3 μm a short 100 ns electric pulse was sufficient for the recording, which is lower than the average minimum of 200 ns reported in the literature. Both the high I_ON/I_OFF ratio and the short recording time we attribute to a fast and efficient mechanism of formation of conducting filaments inside the nanocomposite, due to the action of the external applied electrical field. These results point to the possibility of the development of a "All With One" (AW1) technique, where the overall device is based on a single main material - from the substrate and the active layer to the capsuling.