Effect of Substructure on Hardness and Conductivity of Copper During Annealing

Srijan Sengupta; Pawan Kumar; Mamookho Elizabeth Makhatha; Aniket Kumar Dutt

doi:10.1007/s12666-020-01932-w

Effect of Substructure on Hardness and Conductivity of Copper During Annealing

Srijan Sengupta, Pawan Kumar, Mamookho Elizabeth Makhatha, Aniket Kumar Dutt

Metallurgy

Research output: Contribution to journal › Article › peer-review

Abstract

In the present investigation, the effect of substructures on hardness and conductivity during partial annealing of cold-rolled copper was studied. Substructures were observed after annealing at lower temperature; however, the annealed sample (at higher temperature) was mostly free from substructures. Therefore, it is proposed that the restoration mechanism at lower temperature envisages recovery in copper; however, it is partial recrystallization at higher temperature. There was an increase in hardness observed at lower temperature due to higher fraction of substructures, while an increase in conductivity was observed at higher temperature due to partial recrystallization. It was confirmed that the twin boundaries produced during cold rolling provided dislocations pinning, leading to greater tensile strength.

Original language	English
Pages (from-to)	1543-1547
Number of pages	5
Journal	Transactions of the Indian Institute of Metals
Volume	73
Issue number	6
DOIs	https://doi.org/10.1007/s12666-020-01932-w
Publication status	Published - 1 Jun 2020

Keywords

Cold rolling
Conductivity
Copper
Hardness

ASJC Scopus subject areas

Metals and Alloys

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10.1007/s12666-020-01932-w

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title = "Effect of Substructure on Hardness and Conductivity of Copper During Annealing",

abstract = "In the present investigation, the effect of substructures on hardness and conductivity during partial annealing of cold-rolled copper was studied. Substructures were observed after annealing at lower temperature; however, the annealed sample (at higher temperature) was mostly free from substructures. Therefore, it is proposed that the restoration mechanism at lower temperature envisages recovery in copper; however, it is partial recrystallization at higher temperature. There was an increase in hardness observed at lower temperature due to higher fraction of substructures, while an increase in conductivity was observed at higher temperature due to partial recrystallization. It was confirmed that the twin boundaries produced during cold rolling provided dislocations pinning, leading to greater tensile strength.",

keywords = "Cold rolling, Conductivity, Copper, Hardness",

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T1 - Effect of Substructure on Hardness and Conductivity of Copper During Annealing

AU - Sengupta, Srijan

AU - Kumar, Pawan

AU - Makhatha, Mamookho Elizabeth

AU - Dutt, Aniket Kumar

PY - 2020/6/1

Y1 - 2020/6/1

N2 - In the present investigation, the effect of substructures on hardness and conductivity during partial annealing of cold-rolled copper was studied. Substructures were observed after annealing at lower temperature; however, the annealed sample (at higher temperature) was mostly free from substructures. Therefore, it is proposed that the restoration mechanism at lower temperature envisages recovery in copper; however, it is partial recrystallization at higher temperature. There was an increase in hardness observed at lower temperature due to higher fraction of substructures, while an increase in conductivity was observed at higher temperature due to partial recrystallization. It was confirmed that the twin boundaries produced during cold rolling provided dislocations pinning, leading to greater tensile strength.

AB - In the present investigation, the effect of substructures on hardness and conductivity during partial annealing of cold-rolled copper was studied. Substructures were observed after annealing at lower temperature; however, the annealed sample (at higher temperature) was mostly free from substructures. Therefore, it is proposed that the restoration mechanism at lower temperature envisages recovery in copper; however, it is partial recrystallization at higher temperature. There was an increase in hardness observed at lower temperature due to higher fraction of substructures, while an increase in conductivity was observed at higher temperature due to partial recrystallization. It was confirmed that the twin boundaries produced during cold rolling provided dislocations pinning, leading to greater tensile strength.

KW - Cold rolling

KW - Conductivity

KW - Copper

KW - Hardness

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JO - Transactions of the Indian Institute of Metals

JF - Transactions of the Indian Institute of Metals

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ER -

Effect of Substructure on Hardness and Conductivity of Copper During Annealing

Abstract

Keywords

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