Effect of Substructure on Hardness and Conductivity of Copper During Annealing

Srijan Sengupta, Pawan Kumar, Mamookho Elizabeth Makhatha, Aniket Kumar Dutt

Research output: Contribution to journalArticlepeer-review


In the present investigation, the effect of substructures on hardness and conductivity during partial annealing of cold-rolled copper was studied. Substructures were observed after annealing at lower temperature; however, the annealed sample (at higher temperature) was mostly free from substructures. Therefore, it is proposed that the restoration mechanism at lower temperature envisages recovery in copper; however, it is partial recrystallization at higher temperature. There was an increase in hardness observed at lower temperature due to higher fraction of substructures, while an increase in conductivity was observed at higher temperature due to partial recrystallization. It was confirmed that the twin boundaries produced during cold rolling provided dislocations pinning, leading to greater tensile strength.

Original languageEnglish
Pages (from-to)1543-1547
Number of pages5
JournalTransactions of the Indian Institute of Metals
Issue number6
Publication statusPublished - 1 Jun 2020


  • Cold rolling
  • Conductivity
  • Copper
  • Hardness

ASJC Scopus subject areas

  • Metals and Alloys


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