TY - CHAP
T1 - Device Technologies and Circuits for 5G and 6G
AU - Božanić, Mladen
AU - Sinha, Saurabh
N1 - Publisher Copyright:
© 2021, The Author(s), under exclusive license to Springer Nature Switzerland AG.
PY - 2021
Y1 - 2021
N2 - This chapter will investigate the detail of available device technologies, as applicable to 5G, as well the research required in the near future that would enable these technologies to promote the emergence of 6G as envisioned in Chap. 1. Alternative technologies, including nanotubes manufactured from graphene and carbon, which may become the technologies of the future, will also be considered in this chapter. Secondly, this chapter will briefly look at the specifics of electronic design at millimeter and terahertz frequencies, which differs from regular electronics design in many respects. Specifically, any electronic circuit that is involved in signal processing in either a transmitter or a receiver requires a specific design methodology, that typically differs from the design of low-frequency equivalents. These specialized circuits include modulators, oscillators, filters, power amplifiers and LNAs, to name a few. Lastly, it should be noted that packaging has a much greater influence on circuits operating at high frequencies than on low-frequency circuitry, which opens up an opportunity for a short discussion on millimeter-wave and terahertz packaging approaches.
AB - This chapter will investigate the detail of available device technologies, as applicable to 5G, as well the research required in the near future that would enable these technologies to promote the emergence of 6G as envisioned in Chap. 1. Alternative technologies, including nanotubes manufactured from graphene and carbon, which may become the technologies of the future, will also be considered in this chapter. Secondly, this chapter will briefly look at the specifics of electronic design at millimeter and terahertz frequencies, which differs from regular electronics design in many respects. Specifically, any electronic circuit that is involved in signal processing in either a transmitter or a receiver requires a specific design methodology, that typically differs from the design of low-frequency equivalents. These specialized circuits include modulators, oscillators, filters, power amplifiers and LNAs, to name a few. Lastly, it should be noted that packaging has a much greater influence on circuits operating at high frequencies than on low-frequency circuitry, which opens up an opportunity for a short discussion on millimeter-wave and terahertz packaging approaches.
UR - http://www.scopus.com/inward/record.url?scp=85102082735&partnerID=8YFLogxK
U2 - 10.1007/978-3-030-69273-5_4
DO - 10.1007/978-3-030-69273-5_4
M3 - Chapter
AN - SCOPUS:85102082735
T3 - Lecture Notes in Electrical Engineering
SP - 99
EP - 154
BT - Lecture Notes in Electrical Engineering
PB - Springer Science and Business Media Deutschland GmbH
ER -