Densification and wear behavior of Cu-TiC composites via spark plasma sintering in situ degassing

Spark plasma sintering (SPS) in situ degassing process of copper reinforced with TiC powder was examined on densification and wear behavior of copper and copper composite samples. Pure Cu and Cu-10 vo l%TiC, Cu-15vo l%TiC, and Cu-20 vo l%TiC were fully densified by degassing the powder from 25 to 550 °C and then sintered from 550 to 650 °C. The influence of the sintering process on the microstructure, phase change, densification, hardness, and wear was investigated. A relative density of 98.5% and 98.8% was obtained in Cu and Cu reinforced with 15 vo l%TiC, respectively. The XRD pattern did not reveal a copper oxide phase. The fracture surfaces show a strong interfacial bonding of TiC with the copper matrix. The Vickers hardness of 140.5 ± 5.03 HV_0.3 was obtained in Cu-15 vo l%TiC composite. The wear tests were done under dry sliding conditions at varying loads (5, 10, 15, and 20 N). The frictional coefficient of Cu was enhanced with TiC contents.