Defect formation and surface evolution of thin film materials

Resego R. Phiri, O. Philip Oladijo, Esther T. Akinlabi

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)


Modern thin film industries require precise tailoring of thin films properties to have excellent performance for specific applications intended. Thin film mechanical behavior and stress presents a technological challenge for material scientists, physics, and engineers. Atomic-scale understanding of the microstructure of thin films is a crucial aspect for the control and manipulation of the film properties for a wide range of industrial applications. Thin film growth of thin films influences the crystallographic orientation of grains, grain shape and distribution thereby affecting their reliability and performance of the material. This article reviews the present understanding of the mechanism(s) determining the microstructural evolution of thin films, defect formation, and the related failure modes. General trends in microstructural evolution, grain morphology, and texture formation mechanisms are briefly discussed in terms of their respective kinetic processes. The temperature dependency of the film microstructure evolution is described using the structure zone models.

Original languageEnglish
Pages (from-to)1087-1093
Number of pages7
JournalProceedings of the International Conference on Industrial Engineering and Operations Management
Issue numberNOV
Publication statusPublished - 2018
EventProceedings of the International Conference on Industrial Engineering and Operations Management Pretoria, IEOM 2018 -
Duration: 29 Oct 20181 Nov 2018


  • Kinetic processes
  • Microstructural evolution
  • Structure zone models
  • Thin film

ASJC Scopus subject areas

  • Strategy and Management
  • Management Science and Operations Research
  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering


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