Comparison of Al and Cu interconnects using VHDL-AMS and SPICE modeling

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Fingerprint

Dive into the research topics of 'Comparison of Al and Cu interconnects using VHDL-AMS and SPICE modeling'. Together they form a unique fingerprint.
Sort by

Keyphrases

Engineering

Computer Science

Physics

Material Science