@inproceedings{8ced4df3c70e4f59883225669ac44b83,
title = "Comparison of Al and Cu interconnects using VHDL-AMS and SPICE modeling",
abstract = "This paper compares the transient characteristics of aluminum (Al) and copper (Cu) microstrip line structures. Interconnects are represented using distributed resistance inductance capacitance (RLC) transmission line (TL) model. The equivalent RLC-ladder networks for Al and Cu interconnects are first implemented using VHDL-AMS, and their time-domain simulation responses are compared. For the verification of the results obtained from VHDL-AMS implementation, the process is repeated with SPICE modeling. Both the simulation results are in good agreement.",
keywords = "Microstrip line, RLC model, SPICE, VHDL-AMS, inductive effects",
author = "Saurabh Chaturvedi and Mladen Bozanic and Saurabh Sinha",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 2nd International Conference on Contemporary Computing and Informatics, IC3I 2016 ; Conference date: 14-12-2016 Through 17-12-2016",
year = "2016",
doi = "10.1109/IC3I.2016.7918031",
language = "English",
series = "Proceedings of the 2016 2nd International Conference on Contemporary Computing and Informatics, IC3I 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "590--593",
editor = "Aradhya, {V N Manjunatha} and Niranjan, {S K}",
booktitle = "Proceedings of the 2016 2nd International Conference on Contemporary Computing and Informatics, IC3I 2016",
address = "United States",
}