An Analysis of geometry characteristics of metal oxide blocks on heat flow rate using Finite Element Analysis

Isaac Doetein, Lutendo Muremi, Pitshou Bokoro

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Citations (Scopus)

Abstract

In this study, cylindrical varistor samples were designed with similar boundary conditions using ANSYS simulation software. Parametric analysis using finite element analysis (FEA) was conducted in a bid to analyse the impact of geometry characteristics of MOV samples on the heat transfer rate for a period of 30 seconds. Simulated MOV samples were subjected to thermal stress ranging from 20°C to 125°C. Simple linear regression analysis (SLR) was used to determine the relationship between the surface area of MOV blocks and heat transfer rate. Simple layer regression in Artificial Neural Networks (ANN) was used to validate the result from SLR. Results from both ANN and SLR show linear relationship between surface area and heat transfer rate, also a correlation between design geometry of the MOV blocks and heat transfer rate as well as time.

Original languageEnglish
Title of host publication2020 IEEE Electrical Insulation Conference, EIC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages163-166
Number of pages4
ISBN (Electronic)9781728154855
DOIs
Publication statusPublished - Jun 2020
Event2020 IEEE Electrical Insulation Conference, EIC 2020 - Knoxville, United States
Duration: 22 Jun 20203 Jul 2020

Publication series

Name2020 IEEE Electrical Insulation Conference, EIC 2020

Conference

Conference2020 IEEE Electrical Insulation Conference, EIC 2020
Country/TerritoryUnited States
CityKnoxville
Period22/06/203/07/20

Keywords

  • finite element analysis
  • geometry
  • heat transfer
  • metal oxide varistor
  • modelling
  • simple linear regression
  • simulation

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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