Abstract
In grinding processes, the grinding fluid is used to suppress the temperature rise in the grinding zone. Under some circumstances, the grinding fluid may undergo film boiling in the grinding zone, causing the workpiece temperature to rise significantly. The onsets of nucleate boiling and film boiling in the grinding zone are investigated in the present study. A model of heat transfer in grinding was previously developed (Jen and Lavine, 1995), which predicts the temperatures and heat fluxes in the grinding zone. With some modification, this model is used here to predict the occurrence of film boiling of the grinding fluid. The dependence of the workpiece background temperature on the various grinding parameters is explored. The workpiece background temperature distribution along the grinding zone, and comparisons with experimental results, are presented.
Original language | English |
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Pages (from-to) | 463-470 |
Number of pages | 8 |
Journal | Journal of Heat Transfer |
Volume | 118 |
Issue number | 2 |
DOIs | |
Publication status | Published - May 1996 |
Externally published | Yes |
Keywords
- Boiling
- Conduction
- Manufacturing processes
- Materials processing
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering