Skip to main navigation Skip to search Skip to main content

A parametric study of solute redistribution during transient liquid phase diffusion bonding process

  • University of Wisconsin
  • General Electric

Research output: Contribution to journal › Article › peer-review

Fingerprint

Dive into the research topics of 'A parametric study of solute redistribution during transient liquid phase diffusion bonding process'. Together they form a unique fingerprint.
Sort by

Engineering

Chemical Engineering

Keyphrases